Method for adhesion of resin material comprising oxymethylene polymer, and structure

摘要

Provided are a method of bonding a resin material (X) containing an oxymethylene-based polymer (A) and a resin material (Y), including: preparing an oxymethylene-based polymer composition (B) as resin material (Y), and resin material (X); or preparing resin material (X) and a resin material identical to resin material (X) or another resin material as resin material (Y), and providing polymer composition (B) between resin material (Y) and resin material (X); and heating: wherein polymer composition (B) has a melting point lower than that of polymer (A), and a difference in melting point between the composition and the polymer is smaller than 5° C.; and 50% or more of a peak area determined from a peak showing the molten state of polymer composition (B) measured by DSC is present in a temperature region lower than the peak temperature of polymer (A) by 5° C. or more; and a structure obtained thereby.