发明名称 |
Solder interconnect by addition of copper |
摘要 |
A method of forming an electronic device provides an electronic device substrate having a solder bump pad located thereover. A nickel-containing layer is located over the solder bump pad. A copper-containing layer is formed on the nickel-containing layer prior to subjecting the electronic device to a reflow process.
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申请公布号 |
US8378485(B2) |
申请公布日期 |
2013.02.19 |
申请号 |
US20090501686 |
申请日期 |
2009.07.13 |
申请人 |
LSI CORPORATION;BACHMAN MARK A.;OSENBACH JOHN W.;DESAI KISHOR V. |
发明人 |
BACHMAN MARK A.;OSENBACH JOHN W.;DESAI KISHOR V. |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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