| 摘要 |
PURPOSE: An epoxy resin composition and a semiconductor device using thereof are provided to improve the fire retardant property without using a halogen group or antimony trioxide generating harmful by-products for the human body. CONSTITUTION: An epoxy resin composition for sealing a semiconductor device contains an epoxy resin, a hardener, a curing accelerator, an inorganic filler, a flame retardant, and an additive. 0.5~10wt% of melamine cyanurate is added to the composition as a flame retardant. The additive is 0.5~10wt% of boron nitride. The conductivity of extracted water of the melamine cyanurate is under 50 us per centimeter. The inorganic filler is crystalline silica. |
