发明名称 |
Semiconductor package |
摘要 |
There is provided a method of manufacturing a semiconductor package. The method includes: (a) providing a semiconductor chip having a first surface and a second surface opposite to the first surface, wherein a pad is formed on the first surface; (b) disposing the semiconductor chip on a supporting substrate such that the first surface is directed upward; (c) forming an encapsulation resin layer on the supporting substrate so as to cover the semiconductor chip; and (d) polishing the encapsulation resin layer to expose a top surface of the pad. |
申请公布号 |
US8378492(B2) |
申请公布日期 |
2013.02.19 |
申请号 |
US20100951509 |
申请日期 |
2010.11.22 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD.;SHIMIZU NORIYOSHI;ROKUGAWA AKIO |
发明人 |
SHIMIZU NORIYOSHI;ROKUGAWA AKIO |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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