发明名称 Coating and developing system control method of controlling coating and developing system
摘要 A coating and developing system and control method is provided. The system and control method curtails the amount of time for which a substrate is held with no purpose while improving the throughput of the coating and developing system. An inspection station through which a substrate processed in a processing station is transferred to a carrier station includes a plurality of different inspection modules respectively taking different inspection times, a buffer unit for temporarily holding a substrate and a substrate carrying means controlled by a controller. When the inspection module is engaged in inspecting a substrate, the substrate carrying means carries another substrate to be inspected by the same inspection module to the buffer unit and the substrate is held in the buffer unit. Thus, the holding of wafers in the inspection modules can be suppressed and the throughput can be improved.
申请公布号 US8377501(B2) 申请公布日期 2013.02.19
申请号 US20070438031 申请日期 2007.09.11
申请人 TOKYO ELECTRON LIMITED;HAYASHIDA YASUSHI;HARA YOSHITAKA;KANEKO TOMOHIRO 发明人 HAYASHIDA YASUSHI;HARA YOSHITAKA;KANEKO TOMOHIRO
分类号 C23C16/52;C23C14/54 主分类号 C23C16/52
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