发明名称 |
Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom |
摘要 |
A package-on-package (POP) package precursor and packaged devices and systems therefrom includes an electronic substrate including electrically conductive layers and a top surface. A first portion of the top surface has an IC die attached thereon. A second portion of the top surface has a plurality of first attach pads on opposing sides of the IC die for electrically coupling to a first electronic device on top of the IC die. At least a third portion of the top surface is positioned laterally with respect to the first and second portion. The third portion includes a plurality of second attach pads for electrically coupling to at least a second electronic device. At least one of the electrically conductive layers includes a coupling trace that couples at least one of the plurality of second attach pads to the IC die and/or one or more of the plurality of first attach pads.
|
申请公布号 |
US8377746(B2) |
申请公布日期 |
2013.02.19 |
申请号 |
US201113244364 |
申请日期 |
2011.09.24 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED;HARPER PETER R.;MAGGIO KENNETH |
发明人 |
HARPER PETER R.;MAGGIO KENNETH |
分类号 |
H01L21/44;H01L21/48 |
主分类号 |
H01L21/44 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|