发明名称 Etchant for metal wiring and method for manufacturing metal wiring using the same
摘要 Exemplary embodiments of the present invention provide a metal wiring etchant. A metal wiring etchant according to an exemplary embodiment of the present invention includes ammonium persulfate, an organic acid, an ammonium salt, a fluorine-containing compound, a glycol-based compound, and an azole-based compound.
申请公布号 US8377325(B2) 申请公布日期 2013.02.19
申请号 US201113032563 申请日期 2011.02.22
申请人 SAMSUNG DISPLAY CO., LTD.;SUH NAM-SEOK;HONG SUN-YOUNG;CHOUNG JONG-HYUN;KIM BONG-KYUN;PARK HONG-SICK;SONG JEAN-HO;LEE WANG-WOO;KIM DO-WON;KIM SANG-WOO;SEO WON-GUK;SHIN HYUN-CHEOL;LEE KI-BEOM;CHO SAM-YOUNG 发明人 SUH NAM-SEOK;HONG SUN-YOUNG;CHOUNG JONG-HYUN;KIM BONG-KYUN;PARK HONG-SICK;SONG JEAN-HO;LEE WANG-WOO;KIM DO-WON;KIM SANG-WOO;SEO WON-GUK;SHIN HYUN-CHEOL;LEE KI-BEOM;CHO SAM-YOUNG
分类号 B44C1/22;C03C15/00;C03C25/68;C23F1/00;C25F3/00 主分类号 B44C1/22
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