发明名称 Imprint lithography with improved substrate/mold separation
摘要 In imprint lithography, a mold having a pattern of projecting and recessed regions is pressed into a moldable surface on a substrate. The thus-imprinted moldable surface is permitted to at least partially harden to retain the imprint, and the substrate and mold are separated. In accordance with the invention, the substrate is separated from the mold by bending laterally distal regions (regions away from the center toward the edges) of the mold transversely away from the interface and transversely restraining the substrate. The mold can then be easily separated from the substrate by transverse displacement. The separation can be facilitated by providing a mold having a lateral dimension that on at least two sides extends beyond the corresponding lateral dimension of the substrate. Alternatively, the substrate can have a greater lateral extent than the mold, and the mold can be restrained. The distal regions of the substrate can be bent in the transverse direction. Apparatus for effecting such separation is also described.
申请公布号 US8377361(B2) 申请公布日期 2013.02.19
申请号 US20070945033 申请日期 2007.11.26
申请人 ZHANG WEI;TAN HUA;HU LIN;CHOU STEPHEN Y. 发明人 ZHANG WEI;TAN HUA;HU LIN;CHOU STEPHEN Y.
分类号 B29C33/44 主分类号 B29C33/44
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