发明名称 Substrate processing apparatus and substrate processing method
摘要 A protruding portion (13), which has a central axis coincident with a rotational axis of a table (10), is formed at a center portion of a surface of the table (10). At the time of the surface processing, the table (10) is rotated under a state in which the processing target surface of the substrate (12) is supported horizontally at each of a plurality of parts on the table (10) spaced apart from a base end of the protruding portion (13) toward an outer peripheral end portion of the table (10) by a predetermined distance and at the same distance from a top end of the protruding portion (13). Then, a processing liquid is supplied toward the top end of the protruding portion (13). The processing liquid that has reached the processing target surface of each substrate (12) is then removed outside the table (10) by centrifugal force.
申请公布号 US8375963(B2) 申请公布日期 2013.02.19
申请号 US201113276586 申请日期 2011.10.19
申请人 MICRO ENGINEERING INC.;MATSUZAWA MINORU 发明人 MATSUZAWA MINORU
分类号 B08B3/04 主分类号 B08B3/04
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