SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME

摘要

PURPOSE: A semiconductor package and a stacked semiconductor package having the same are provided to prevent a trap phenomenon of an adhesive member and to improve reliability. CONSTITUTION: A semiconductor chip includes a through hole(140). A through hole connects one surface to the other surface(110). An insulating layer is formed on one of the two surfaces. A through electrode fills the through hole. A bump is formed on the insulating layer near the through electrode.