发明名称 |
Wiring board having lead pin, and lead pin |
摘要 |
A wiring board having a lead pin is provided. The wiring board having the lead pin includes a connecting pad which is formed on the wiring board, and to which the lead pin is bonded through a conductive material. The lead pin includes: a shaft portion; a head portion which is provided on one end of the shaft portion; a protruded portion which is formed on a surface side of the head portion opposed to the connection pad; and a first taper portion which is formed between the head portion and a base part of the shaft portion.
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申请公布号 |
US8379402(B2) |
申请公布日期 |
2013.02.19 |
申请号 |
US20090633443 |
申请日期 |
2009.12.08 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD.;OSHIMA KAZUHIRO;HIRABAYASHI YOSHIKAZU;NAKAJIMA SHIGEO;MATSUSHITA YOSHITAKA |
发明人 |
OSHIMA KAZUHIRO;HIRABAYASHI YOSHIKAZU;NAKAJIMA SHIGEO;MATSUSHITA YOSHITAKA |
分类号 |
H01R9/00;H01L23/12 |
主分类号 |
H01R9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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