发明名称 Wiring board having lead pin, and lead pin
摘要 A wiring board having a lead pin is provided. The wiring board having the lead pin includes a connecting pad which is formed on the wiring board, and to which the lead pin is bonded through a conductive material. The lead pin includes: a shaft portion; a head portion which is provided on one end of the shaft portion; a protruded portion which is formed on a surface side of the head portion opposed to the connection pad; and a first taper portion which is formed between the head portion and a base part of the shaft portion.
申请公布号 US8379402(B2) 申请公布日期 2013.02.19
申请号 US20090633443 申请日期 2009.12.08
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD.;OSHIMA KAZUHIRO;HIRABAYASHI YOSHIKAZU;NAKAJIMA SHIGEO;MATSUSHITA YOSHITAKA 发明人 OSHIMA KAZUHIRO;HIRABAYASHI YOSHIKAZU;NAKAJIMA SHIGEO;MATSUSHITA YOSHITAKA
分类号 H01R9/00;H01L23/12 主分类号 H01R9/00
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