发明名称 |
Apparatus for spraying etchant onto printed circuit board |
摘要 |
The present invention relates to an apparatus for spraying an etchant and a method for manufacturing a printed circuit board. In one exemplary embodiment the apparatus includes a manifold, a plurality of feed pipes in fluid communication with the manifold, each of the feed pipes having a plurality of spray nozzles mounted thereon, the feed pipes cooperatively constitute a spray region, and a pressure-boosting device configured for increasing a spray pressure of the spray nozzles which are located at a central area of the spray region. The apparatus can overcome the puddle effect on an upper surface of the printed circuit board.
|
申请公布号 |
US8377252(B2) |
申请公布日期 |
2013.02.19 |
申请号 |
US20060614362 |
申请日期 |
2006.12.21 |
申请人 |
ZHEN DING TECHNOLOGY CO., LTD.;LEE WEN-CHIN;LIN CHENG-HSIEN |
发明人 |
LEE WEN-CHIN;LIN CHENG-HSIEN |
分类号 |
H01B13/00;B44C1/22;C23F1/00 |
主分类号 |
H01B13/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|