| 摘要 |
<p>PURPOSE: A method for manufacturing a semiconductor package is provided to facilitate manufacture by forming a redistribution layer after a semiconductor package is loaded. CONSTITUTION: A film-type redistribution layer is formed(S110). The redistribution layer is arranged in a carrier substrate(S120). Multiple semiconductor chips are arranged on the carrier substrate(S130). A molding part is formed in the multiple semiconductor chips(S140). The carrier substrate is removed after the molding part is formed(S150). [Reference numerals] (AA) Start; (BB) End; (S110) Forming a film-type redistribution layer; (S120) Arranging the redistribution layer on a carrier substrate; (S130) Arranging multiple semiconductor chips on the redistribution layer; (S140) Forming a molding part; (S150) Removing the carrier substrate; (S160) Forming an external connection member; (S170) Cutting into multiple package units</p> |
