| 摘要 |
PURPOSE: A potting system in a semiconductor chip packaging process and a control method thereof are provided to improve potting speed by alternately potting a pair of rails. CONSTITUTION: A tape is queued for a potting process in a plurality of rails(141,142). A potting head(120) pots the tape queued on the plurality of rails. The potting head moves between the plurality of rails. A control unit transfers the potting head to a location of the rail. The control unit controls the potting head in order to perform the potting process. |
