| 摘要 |
<p>PURPOSE: A semiconductor package is provided to completely separate a bump from a plug in a first area and to prevent the delamination of the bump. CONSTITUTION: A second semiconductor chip is arranged in the upper surface of a first semiconductor chip. The second semiconductor chip has a first area and a second area. A plug(140) is formed in the first area of the first semiconductor chip. Conductive bumps(150,160) are formed between the plug and the second semiconductor chip. The conductive bumps electrically connect the plug and the second semiconductor chip. [Reference numerals] (AA,CC) Second area; (BB) First area</p> |
