| 摘要 |
PURPOSE: A bonding device is provided to simply arrange substrates by using an alignment means. CONSTITUTION: An upper board(111) is formed on the upper inside of a chamber(100) and supports a first substrate(113). A lower board(121) is formed on the lower inside of the chamber and supports a second substrate(127). One end of an alignment actuator(200,210,220) is combined with the lower part of the lower board by using an upper universal link. The other end of an alignment actuator is combined with a support stand by using a lower universal link. The alignment actuator stretches to arrange the lower board. |
