| 摘要 |
PURPOSE: A socket for testing an electronic module chip is provided to reduce manufacturing costs by manufacturing a pin block fitting only to the electronic module chip, and connecting the pin block with a detachable guide plate. CONSTITUTION: A guide plate(5) comprises a setting groove to fit an electronic module chip in. A pin block(7) is detached from the front of the guide plate, or is attached to the same. Pogo pins of the pin block are connected to pins of the electronic module chip. If more than one defect is found in the pogo pins, the defected pogo fin is detached from the guide plate. |
