| 摘要 |
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to simplify a package structure by directly connecting a second semiconductor chip to a package part using a through electrode. CONSTITUTION: A rewiring layer is arranged on the lower side of a first semiconductor chip(110). The rewiring layer is electrically connected to the first semiconductor chip. A via hole covers the first semiconductor chip and exposes the rewiring layer. A through electrode(130) is arranged in the via hole and a mold member. A second semiconductor chip(200) is electrically connected to the through electrode. |
