| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can use a general-purpose lead frame having high reliability even when a signal transmission speed is accelerated. <P>SOLUTION: A semiconductor device 1 according to the present invention comprises: inside bonding wires 20; inside bonding terminals 100; wirings 110; outside bonding terminals 120; outside bonding wires 30; and signal transmission means electrically connecting in this order from each of bonding pads 90 to each of inner leads 60. The inside bonding terminals 100, the wiring 110 and the outside bonding terminals 120 are formed on an insulating member 40. The signal transmission means is adjusted by each wire length of the wiring 110 such that distances of signal transmission paths from the bonding pads 90 to tips of outer leads 70 become substantially equal with each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
