Three-Dimensionally Molded Electronic Substrate

摘要

A device, system and process for fabricating a three-dimensional electronic substrate are disclosed. A substrate may be molded in three-dimensions to fit the form factor of an exterior device frame. Electronics and conductors may be placed onto the three-dimensional surface of the molded substrate, thereby creating a three-dimensional electronic substrate. The three dimensional substrate may then be connected to an exterior frame to allow for electronic functionalities across frame form factors.