发明名称 |
MEMS DEVICE AND METHOD OF FORMATION THEREOF |
摘要 |
The present disclosure provides a method including providing a first substrate; and forming a microelectromechanical system (MEMS) device on a first surface of the first substrate. A bond pad is formed on at least one bonding site on the first surface of the first substrate. The bonding site is recessed from the first surface. Thus, a top surface of the bond pad may lie below the plane of the top surface of the substrate. A device with recessed connective element(s) (e.g., bond pad) is also described. In further embodiments, a protective layer is formed on the recessed connective element during dicing of a substrate. |
申请公布号 |
US2013037891(A1) |
申请公布日期 |
2013.02.14 |
申请号 |
US201113206014 |
申请日期 |
2011.08.09 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,("TSMC");HUANG HSIN-TING;PENG JUNG-HUEI;TSAI SHANG-YING;HUANG YAO-TE;WU MING-TUNG;LIU PING-YIN;HUANG XIN-HUA;HSIEH YUAN-CHIH |
发明人 |
HUANG HSIN-TING;PENG JUNG-HUEI;TSAI SHANG-YING;HUANG YAO-TE;WU MING-TUNG;LIU PING-YIN;HUANG XIN-HUA;HSIEH YUAN-CHIH |
分类号 |
H01L29/84;H01L21/02 |
主分类号 |
H01L29/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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