| 摘要 |
PURPOSE: A thermoconductive adhesive is provided to obtain excellent adhesion than a conventional thermal conductive silicone and to have excellent thermal conductivity. CONSTITUTION: A thermoconductive adhesive is obtained by compounding a binder, which silicon and epoxy are polymerized and mixed, and a filler which is formed by mixing an Ag-coating material and inorganic particles with uniform particle size. The composite material of the binder and filler has a thermal conductivity of 1.1 W/m.k or more and an adhesion of 28.7 MPa or more. The binder has using-temperature regions of a low temperature region(80-100deg. C), high temperature region(130-150deg. C), and an ultra-high temperature region(170-200deg. C). The filler is copper coated with silver, and is obtained by coating the surface of the copper with the silver by a dry process. |
