| 摘要 |
PURPOSE: An epoxy resin composition and a metal base printed circuit board comprising the same are provide to have excellent thermal conductivity, internal voltage, bending property, punching property, moldability, heat resistance, and moisture resistance. CONSTITUTION: An epoxy resin composition and a metal base printed circuit board comprises: one or more epoxy resin selected from a bisphenol-A type epoxy resin, a bisphenol-F type epoxy resin, a cresol novolak type epoxy resin, a dicyclopentadiene type epoxy resin, a triphenylmethane type epoxy resin, a naphthalene type epoxy resin, a biphenyl type epoxy resin, and a hydrogen-added epoxy resin thereof; a dimer acid-modified epoxy resin; a hardening agent; a hardening accelerator; and an inorganic filler. The epoxy resin composition comprises 5-40 parts by weight of the dimer acid-modified epoxy resin, 0.005-0.05 parts by weight of the hardening accelerator, and 200-400 parts by weight of the inorganic filler based on 100.0 parts by weight of the mixture of the epoxy resin and the hardening agent. An insulation layer(2) for a metal based printed circuit board is formed of the epoxy resin composition. |
