发明名称 OPTICAL SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD OF OPTICAL SEMICONDUCTOR ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an optical semiconductor element having a first connection electrode and a second connection electrode which are suitable for flip-chip mounting and respectively have no level difference. <P>SOLUTION: An optical semiconductor element 10 comprises: a first semiconductor layer 12 composed of a semiconductor of a first conductivity type; a second semiconductor layer 13 composed of a semiconductor of a second conductivity type and formed on a part of an upper surface of the first semiconductor layer; a first electrode 14a formed on the other part of the upper surface of the first semiconductor layer 12; a second electrode 14b formed on an upper surface of the second semiconductor layer 13 and having an upper surface in a position higher than the upper surface of the first electrode; a first connection electrode 52 formed on the upper surface of the first electrode; a second connection electrode 51 formed on the upper surface of the second electrode; and an insulating protective film 15 covering a surface of the first semiconductor layer 12 and a surface of the second semiconductor layer 13 and having an opening 21 from which a part of the surface of the first semiconductor layer 12 is exposed. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013033893(A) 申请公布日期 2013.02.14
申请号 JP20110208041 申请日期 2011.09.22
申请人 SHARP CORP 发明人 SAWAI KEIICHI;AGO FUJIO;WATANABE YUJI;KAWAKAMI KATSUJI
分类号 H01L33/38 主分类号 H01L33/38
代理机构 代理人
主权项
地址