| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing liquid for electronic materials which can reduce number of particles attached to a substrate after polishing compared to conventional polishing liquid in a polishing stage in the production processes of electronic materials; and a method for producing electronic materials including a stage of polishing an electronic material intermediate product by using this polishing liquid. <P>SOLUTION: This polishing liquid includes an 8-36C aliphatic amine alkylene oxide adduct (B) and water as essential components. The method for producing the electronic materials includes a stage of polishing the electronic material intermediate product by using this polishing liquid. <P>COPYRIGHT: (C)2013,JPO&INPIT |
