发明名称 Double-Layer Injection Molding Casing and Method for Manufacturing the Same,Electronic Apparatus
摘要 A double-layer injection molding casing and a method for manufacturing the same, an electronic apparatus are provided by this invention, which adapts to an injection molding field and can solve the problems of a conventional double-layer injection molding casing such as complicated manufacturing process and low production efficiency. The double-layer injection molding casing of this invention includes an outer layer and an inner layer. A locating structure integrally formed with the inner layer is located at an inner surface of the inner layer. The method for manufacturing the double-layer injection molding casing includes: applying a multiple injection molding process, wherein the locating structure of the double-layer injection molding casing is integrally formed with the inner layer in the same injection molding step. The electronic apparatus of this invention includes the double-layer injection molding casing. The double-layer injection molding casing can be used as a casing of the electronic apparatus.
申请公布号 US2013038992(A1) 申请公布日期 2013.02.14
申请号 US201113642517 申请日期 2011.12.23
申请人 HISENSE HIVIEW TECH CO., LTD.;WANG DEJUN;ZHANG WANGJUN;JIANG HAODE 发明人 WANG DEJUN;ZHANG WANGJUN;JIANG HAODE
分类号 A47B55/00;A47B96/04;B29C45/16;H05K5/02 主分类号 A47B55/00
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