发明名称 |
Double-Layer Injection Molding Casing and Method for Manufacturing the Same,Electronic Apparatus |
摘要 |
A double-layer injection molding casing and a method for manufacturing the same, an electronic apparatus are provided by this invention, which adapts to an injection molding field and can solve the problems of a conventional double-layer injection molding casing such as complicated manufacturing process and low production efficiency. The double-layer injection molding casing of this invention includes an outer layer and an inner layer. A locating structure integrally formed with the inner layer is located at an inner surface of the inner layer. The method for manufacturing the double-layer injection molding casing includes: applying a multiple injection molding process, wherein the locating structure of the double-layer injection molding casing is integrally formed with the inner layer in the same injection molding step. The electronic apparatus of this invention includes the double-layer injection molding casing. The double-layer injection molding casing can be used as a casing of the electronic apparatus.
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申请公布号 |
US2013038992(A1) |
申请公布日期 |
2013.02.14 |
申请号 |
US201113642517 |
申请日期 |
2011.12.23 |
申请人 |
HISENSE HIVIEW TECH CO., LTD.;WANG DEJUN;ZHANG WANGJUN;JIANG HAODE |
发明人 |
WANG DEJUN;ZHANG WANGJUN;JIANG HAODE |
分类号 |
A47B55/00;A47B96/04;B29C45/16;H05K5/02 |
主分类号 |
A47B55/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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