| 摘要 |
<p>PURPOSE: A semiconductor package and a manufacturing method thereof are provided to improve flatness by bonding a polymer layer to a carrier or a substrate with a semiconductor chip to suppress the warpage of a semiconductor substrate. CONSTITUTION: A semiconductor chip(120) is mounted on the upper side of a substrate(110). The semiconductor chip includes an activation surface(122) and an inactivation surface(124). A first polymer layer(130) is formed on the substrate. A second polymer layer(140) fills a space between the first polymer and the side of the semiconductor chip. A rewiring layer(150) includes a rewiring(152) which is electrically connected to a pad(126) of the semiconductor chip.</p> |
