发明名称 FILM WORKING METHOD
摘要 <p>Provided is a film working method which is carried out at low energy, and which has superior work precision and work quality. A film working method removes a site to be removed on a film which is formed upon one face of a substrate by projecting a laser beam, forming a removed area. The laser beam projection projects two or more shots of a laser beam from a pulse laser light source. The first shot of the laser beam has an energy density which removes between 50% or more and less than 100% of the site to be removed in a perpendicular direction of the plane of the film. Each of the second and successive shots of the laser beam has 50%-100% of the energy density which the first shot of the laser beam has. The interval between shots of the laser beam is one second or more.</p>
申请公布号 WO2013021995(A1) 申请公布日期 2013.02.14
申请号 WO2012JP70091 申请日期 2012.08.07
申请人 OSAKA UNIVERSITY;ASAHI GLASS COMPANY, LIMITED;SATOH RYOHEI;IWATA YOSHIHARU;MIYAGAWA HARUHIKO;NIU GUANGYAO 发明人 SATOH RYOHEI;IWATA YOSHIHARU;MIYAGAWA HARUHIKO;NIU GUANGYAO
分类号 B23K26/36;B23K26/00;B23K26/18 主分类号 B23K26/36
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