发明名称 |
FILM WORKING METHOD |
摘要 |
<p>Provided is a film working method which is carried out at low energy, and which has superior work precision and work quality. A film working method removes a site to be removed on a film which is formed upon one face of a substrate by projecting a laser beam, forming a removed area. The laser beam projection projects two or more shots of a laser beam from a pulse laser light source. The first shot of the laser beam has an energy density which removes between 50% or more and less than 100% of the site to be removed in a perpendicular direction of the plane of the film. Each of the second and successive shots of the laser beam has 50%-100% of the energy density which the first shot of the laser beam has. The interval between shots of the laser beam is one second or more.</p> |
申请公布号 |
WO2013021995(A1) |
申请公布日期 |
2013.02.14 |
申请号 |
WO2012JP70091 |
申请日期 |
2012.08.07 |
申请人 |
OSAKA UNIVERSITY;ASAHI GLASS COMPANY, LIMITED;SATOH RYOHEI;IWATA YOSHIHARU;MIYAGAWA HARUHIKO;NIU GUANGYAO |
发明人 |
SATOH RYOHEI;IWATA YOSHIHARU;MIYAGAWA HARUHIKO;NIU GUANGYAO |
分类号 |
B23K26/36;B23K26/00;B23K26/18 |
主分类号 |
B23K26/36 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|