| 摘要 |
PURPOSE: A wire saw apparatus for cutting an ingot is provided to change an entry position for supplying a wire which rotates along the outer circumference surface of a cutting roller, thereby not only cutting the entire ingot, but selectively cutting the ingot in order to control the number of wafers to be produced. CONSTITUTION: A wire saw apparatus for cutting an ingot includes a work plate(10), a cutting roller(20), a supplying bobbin(31), a recovering bobbin(41), and a roller part(32). The work plate, to which an ingot(1) is attached, is installed to be liftable up and down. A pair of cutting rollers is installed to be downwardly separated from the work plate. A wire wounded on the outer circumference surface of the cutting rollers is rotated in order to cut the ingot. The supplying bobbin and the recovering bobbin are respectively installed at one side and the other side of the cutting rollers, and supply and recover the wire. The roller part is equipped with a guide roller(33), an entry roller(34), and a correction roller(35). The guide roller guides the wire from the supplying bobbin to a heading direction. The entry roller(34) changes an entry position for supplying wire from the cutting rollers. The correction roller(35) corrects the path for supplying the wire from the guide roller to the entry roller. |
