| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component packaging system and an inspection image creation method in a component packaging system, which can perform inspection of a mounted state of an electronic component on a substrate with high accuracy even when the electronic component to be an imaging object is a chip component. <P>SOLUTION: A component packaging system comprises: an A/D conversion part 40b A/D converting analog signals output from a photoelectric conversion element 40a of an inspection head 40 to create digital signals of a predetermined numbers of bits representing a luminance value; a signal compression part 40c compressing the created digital signals to digital signals having less number of bits than the digital signals A/D converted by the A/D conversion part 40b by reducing one or a plurality of bits variably set depending on a type of a component 4 to be an imaging object from the digital signals created by the A/D conversion part 40b; and an image creation part 40d creating an inspection image on the basis of the digital signals compressed by the signal compression part 40c. When the component 4 is a chip component, the bit to be reduced in compression of the digital signal is set at a higher order bit. <P>COPYRIGHT: (C)2013,JPO&INPIT |
