SEMICONDUCTOR INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE EQUIPPED WITH THE SAME AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit which ensures adhesiveness of a protection film with inhibiting detachment of the protection film in dicing and achieves downsizing of a chip size.

SOLUTION: A semiconductor integrated circuit comprises: a seal ring 3 formed in vicinity of a scribe region 2; a pad 4; a wiring 5 formed between the seal ring 3 and the pad 4; the seal ring 3; dummy patterns 8; a protection film 6; and a protection film 7. An end edge 9 of the protection film 7 is located between the seal ring 3 and the pad 4. Edges of parts on the dummy patterns 8 are located within a distance of 5 μm in a peripheral edge side direction and a center part side direction of the semiconductor chip 1 with centering around the end edge 9 of the protection film 7, the edges facing each other across the wiring 5.

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