发明名称 |
CIRCUIT BOARD AND FABRICATION METHOD THEREOF |
摘要 |
A method for fabricating a circuit board is provided. A non-conductive material layer is provided on a core substrate, wherein the non-conductive material layer comprises a dielectric material and catalytic particles. A recessed circuit structure is then formed in the non-conductive material layer with a laser beam. Simultaneously, the catalytic particles in the recessed circuit structure are activated with aid of the laser. A buried conductive structure is then formed in the recessed circuit structure by chemical copper deposition methods.
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申请公布号 |
US2013040071(A1) |
申请公布日期 |
2013.02.14 |
申请号 |
US201213653423 |
申请日期 |
2012.10.17 |
申请人 |
UNIMICRON TECHNOLOGY CORP.;UNIMICRON TECHNOLOGY CORP. |
发明人 |
YU CHENG-PO;CHANG CHI-MIN;CHENG WEI-MING |
分类号 |
B05D5/00;B05D3/06 |
主分类号 |
B05D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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