| 发明名称 |
LIGHT EMITTING DIODE CHIP |
| 摘要 |
A light emitting diode (LED) chip including: a substrate; and a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, sequentially deposited on the substrate, in which when a length of the substrate is L and a width of the substrate is W, L/W>10.
|
| 申请公布号 |
US2013037801(A1) |
申请公布日期 |
2013.02.14 |
| 申请号 |
US201213654169 |
申请日期 |
2012.10.17 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD.;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KOIKE MASAYOSHI;KIM BUM JOON |
| 分类号 |
H01L33/02;H01L33/32;H01L33/60;H01L33/62 |
主分类号 |
H01L33/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
