LIQUID CRYSTAL PLATE AND CHIP-ON-FILM TAPE COILING SUBSTRATE

摘要

Disclosed is a chip-on-film tape coiling substrate of a liquid crystal plate. The tape coiling substrate is arranged with a plurality of chip-on-film encapsulation units (21, 22) along the vertical direction (M1) of the tape coiling substrate, wherein the encapsulation units (21, 22) include a drive chip (301), an input lead (213) and an output lead (214), the direction of length (M2) of the drive chip (301) is parallel to the vertical direction (M1) of the tape coiling substrate, and the input lead (213) and the output lead (214) are arranged at two sides of the drive chip (301). Each encapsulation unit (21, 22) is provided with a short broadside (211, 221) and a long broadside (212, 222), the input lead (213) is provided at the short broadside (211, 221), and the output lead (214) is provided at the long broadside (212, 222). Among adjacent encapsulation units, the short broadside (211) of one encapsulation unit (21) is interfaced with the long broadside (222) of another encapsulation unit (22). Also disclosed is a liquid crystal plate applying the tape coiling substrate.