| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin powder composition that can reduce adhesion to a processing unit and a molding apparatus sufficiently, and can manufacture a tablet with high mechanical strength; and to provide a thermosetting resin tablet to be molded by using the same. <P>SOLUTION: This invention relates to the thermosetting resin powder composition, comprising an epoxy resin (A), a curing agent (B), a white pigment (C), and a water-repellent powder (D). The epoxy resin (A) contains an epoxy resin having a weight average molecular weight of 500 to 5,000. The curing agent (B) contains an acid anhydride curing agent having a weight average molecular weight of 500 to 5,000. <P>COPYRIGHT: (C)2013,JPO&INPIT |
