| 摘要 |
<p>1298115 Electric couplings INTERNATIONAL BUSINESS MACHINES CORP 22 July 1970 [14 Aug 1969] 35468/70 Heading H2E [Also in Division H1] A plurality of metal bonding pads disposed around the periphery of one face of an integrated circuit chip are mechanically attached to corresponding metal regions on a substrate by electrically conductive spacing connections not all of which have the same shear resistance. Differences in shear resistance are achieved by using different materials in different connections, e.g. by using copper balls in some while others consist entirely of solder, by using similar amounts of solder at all joints in association with different sized wettable areas on the substrate regions and/or bonding pads, by using different amounts of solder with identical wettable areas or any combination of these techniques. Where all connections serve as electrical circuit connections stronger joints are used at points of maximum thermal stress and 'vice versa but if some joints have only a spacing and mechanical function they may be weakest and located at points of maximum stress. Wettable areas may be limited by glass barriers crossing the metal region or by coating certain areas with non-wettable metal.</p> |
