| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which improves the productivity and the reliability. <P>SOLUTION: In a first joint process, a laminated body 2 obtained by laminating a semiconductor chip 10, a first resin layer 11, a semiconductor chip 12, a second resin layer 13, and a semiconductor chip 14 is heated in the state where the semiconductor chips 10 and 12 are not solder jointed to the semiconductor chips 12 and 14, and then the solder joint is performed between the semiconductor chips 10 and 12 and between the semiconductor chips 12 and 14. Subsequently, the laminated body 2 which is solder jointed is installed on a base material 18. The laminated body 2 is installed on the base material 18 so that a terminal for connection 162 of the laminated body 2 connecting with the base material 18 and a terminal for connection 181 of the base material 18 connecting with the laminated body 2 contact with each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
