发明名称 |
Method of Multi-Chip Wafer Level Packaging |
摘要 |
A method of multi-chip wafer level packaging comprises forming a reconfigured wafer using a plurality of photo-sensitive material layers. A plurality of semiconductor chips and wafers are embedded in the photo-sensitive material layers. Furthermore, a variety of through assembly vias are formed in the photo-sensitive material layers. Each semiconductor chip embedded in the photo-sensitive material layers is connected to input/output pads through connection paths formed by the through assembly vias.
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申请公布号 |
US2013040423(A1) |
申请公布日期 |
2013.02.14 |
申请号 |
US201113206602 |
申请日期 |
2011.08.10 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.;TUNG CHIH-HANG;YU CHUN HUI;YU CHEN-HUA;SHIH DA-YUAN |
发明人 |
TUNG CHIH-HANG;YU CHUN HUI;YU CHEN-HUA;SHIH DA-YUAN |
分类号 |
H01L21/56;H01L21/82 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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