ADHESIVE COMPOSITION, FILM ADHESIVE AND CIRCUIT CONNECTING MATERIAL USING THE ADHESIVE COMPOSITION, CONNECTION STRUCTURE FOR CIRCUIT MEMBER, AND METHOD OF MANUFACTURING THE CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition that can obtain sufficient adhesive strength even to an adherend configured by an inorganic material and can obtain the stable adhesive strength under high-temperature, high-humidity condition.

SOLUTION: The adhesive composition comprises (A) an organoaluminum complex, (B) a silane coupling agent, and (C) a curable component.

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