| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide test equipment of a semiconductor device and a test method of the semiconductor device capable of accurately detecting presence/absence and a position of a void which affects durability performance as the semiconductor device. <P>SOLUTION: Test equipment 1 of a semiconductor device 2 having a semiconductor element 6 mounted on a substrate by a solder joint includes: a power supply part 12 for applying ON voltage to the semiconductor element 6; a short circuit 15 for electrifying the semiconductor element 6 with short circuit current when the ON voltage is applied to the semiconductor element 6; and control means 11 for electrifying the semiconductor element 6 with the short circuit current for predetermined time beforehand set on the basis of a relation between size and a position of a void generated in the solder joint part and short circuit tolerance time. <P>COPYRIGHT: (C)2013,JPO&INPIT |
