PANEL SUBSTRATE CUTTING METHOD AND SUBSTRATE CUTTING DEVICE

摘要

A panel substrate cutting method and a substrate cutting device (100). The substrate cutting device (100) includes a first cutting unit (130) and a second cutting unit (140). The panel substrate cutting method includes the following steps: cutting off a first side residual sheet (104) and a second side residual sheet (105) at two opposite sides of a panel substrate (101); cutting off a third side residual sheet (106) and a fourth side residual sheet (107) at another two opposite sides of the panel substrate (101); cutting the panel substrate (101) into a plurality of rectangular substrates (102); and cutting each of the rectangular substrates (102) into a panel unit (103). The cutting stroke time of the panel substrate (101) can be reduced.