发明名称 BONDED PLATE-LIKE BODY INSPECTION DEVICE AND METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a bonded plate-like body inspection device capable of obtaining information that can accurately show each size of many bubbles scattered in an adhesive agent. <P>SOLUTION: A bonded plate-like body inspection device comprises: a line sensor camera 50; illumination means 51 and 52 for illuminating the line sensor camera 50 through a bonded plate-like body 10; and a processing unit for, when the line sensor camera scans the bonded plate-like body in a state of being illuminated by the illumination means, processing a picture signal to be output from the line sensor camera. The processing unit, from a gray value profile in a direction crossing a dark ring that is obtained from inspection image information consisting of a pixel-by-pixel gray value which is generated on the basis of the picture signal from the line sensor camera, generates bubble size information on the basis of distance between two dark parts corresponding to the dark ring on an inspection image. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013033028(A) 申请公布日期 2013.02.14
申请号 JP20120129946 申请日期 2012.06.07
申请人 SHIBAURA MECHATRONICS CORP 发明人 HAYASHI YOSHINORI;WAKABA HIROYUKI;IZUTSU TADASHI;SEKI KATSUTOSHI;ONO YOKO;GONDO TAKANORI
分类号 G01N21/958 主分类号 G01N21/958
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