| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer transfer apparatus which reduces a footprint by sharing a transfer space of a semiconductor wafer between multiple inspection chambers. <P>SOLUTION: A wafer transfer apparatus 10 of this invention comprises: a wafer housing chamber 11 housing a housing F; a pre-alignment chamber 12 disposed at a lower side of the wafer housing chamber 11; a first wafer transfer chamber 14 having a first wafer transfer mechanism 13 which is disposed in a vertical direction along the wafer housing chamber 11 and the pre-alignment chamber 12 and transfers the semiconductor wafer between the wafer housing chamber 11 and the pre-alignment chamber 12; an alignment chamber 15 disposed at a position that sandwiches the pre-alignment chamber 12 with the first wafer transfer chamber 14; and a second wafer transfer chamber 17 having a second wafer mechanism 16 which moves along the alignment direction of the first wafer transfer chamber 14, the pre-alignment chamber 12, and the alignment chamber 15 and moves in the vertical direction. <P>COPYRIGHT: (C)2013,JPO&INPIT |
