发明名称 |
SUBSTRATE FOR SUPERCONDUCTING COMPOUND AND METHOD FOR MANUFACTURING THE SUBSTRATE |
摘要 |
Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of lOnm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body. |
申请公布号 |
US2013040821(A1) |
申请公布日期 |
2013.02.14 |
申请号 |
US201013510406 |
申请日期 |
2010.11.12 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD.;TOYO KOHAN CO., LTD.;OKAYAMA HIRONAO;NANBU KOUJI;KANEKO AKIRA;OTA HAJIME;OHKI KOTARO;YAMAGUCHI TAKASHI;HAYASHI KAZUHIKO;OHMATSU KAZUYA |
发明人 |
OKAYAMA HIRONAO;NANBU KOUJI;KANEKO AKIRA;OTA HAJIME;OHKI KOTARO;YAMAGUCHI TAKASHI;HAYASHI KAZUHIKO;OHMATSU KAZUYA |
分类号 |
H01L39/02;B32B15/18;B32B15/20;H01L39/24 |
主分类号 |
H01L39/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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