| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method which improves the yield of a photoelectric conversion device. <P>SOLUTION: In a manufacturing method of a photoelectric conversion device, a through connection part 91 penetrating through a semiconductor substrate 1 is formed without forming a through hole in the semiconductor substrate 1 in advance. The manufacturing method of the photoelectric conversion device comprises the steps of: applying a conductive paste containing a second conductive type impurity to a light receiving surface of the semiconductor substrate 1 while patterning through the conductive paste thereon; performing heat treatment on the semiconductor substrate and thereby forming a light receiving surface first electrode 9, the through connection part 91 formed by an alloy layer of the semiconductor substrate and the impurity, and a second semiconductor layer 31 including the impurity. <P>COPYRIGHT: (C)2013,JPO&INPIT |
