| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate capable of preventing or suppressing an occurrence of a solder crack due to stress applied to solder in a state that a plurality of external mounting terminals is mounted on a mounting substrate via the solder, and further to provide an electronic device and an electronic apparatus. <P>SOLUTION: A substrate has a base 51 and a plurality of external mounting terminals 9 that is formed on an undersurface of the base 51 and is bonded to a mounting substrate via solder. Further, the external mounting terminals 9 includes sub-electrode terminals 921 and 922. As viewed in a plan view of the base 51, when a circle 300 circumscribed with the sub-electrode terminals 921 and 922 is defined, all external mounting terminals 9 are included in the circle 300, and circle circumscribing portions 921a and 922a of the sub-electrode terminals 921 and 922 with which the circle 300 is circumscribed extend along the circumference of the circle 300 and are disposed so as to eb opposite to each other via the center O of the circle 300. <P>COPYRIGHT: (C)2013,JPO&INPIT |
