发明名称 COOLING DEVICE AND ELECTRONIC APPARATUS USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a cooling device which improves the cooling performance and achieves the low height. <P>SOLUTION: A cooling device comprises: an evaporation part 2 internally provided with a refrigerant evaporated with heat generated by a heating element; a condensation part condensing the evaporated refrigerant by conducting heat exchange with an external fluid; a first connection pipe 4a carrying the refrigerant evaporated in the evaporation part to the condensation part; and a second connection pipe 4b carrying the refrigerant condensed in the condensation part to the evaporation part. The condensation part comprises: a first connection part 11 connecting with the first connection pipe; a second connection part 12 connecting with the second connection pipe; and a heat radiation part 8 connecting with the first connection part and the second connection part and radiating heat of the refrigerant. The first connection part and the second connection part are disposed at substantially the same height relative to the vertical direction, and a position that the first connection pipe connects with the condensation part is provided at a position higher than a position that the second connection pipe connects with the condensation part in the vertical direction. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013033807(A) 申请公布日期 2013.02.14
申请号 JP20110168397 申请日期 2011.08.01
申请人 NEC CORP 发明人 MATSUNAGA ARIHITO;YOSHIKAWA MINORU;SAKAMOTO HITOSHI;KOMICHIGUCHI AKIRA;INABA KENICHI
分类号 H01L23/427;F28D15/02 主分类号 H01L23/427
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