发明名称 CAMERA MODULE, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD
摘要 A camera module includes an imaging sensor, a conductive member, a plate-like member, and a sealing member. The imaging sensor includes a light-receiving surface configured to receive light gathered by a lens unit, the lens unit including a lens and a drive section driving the lens. The conductive member is connected to the drive section for supply of power to the drive section. The plate-like member is provided with the imaging sensor and the conductive member. The sealing member is formed by sealing the imaging sensor and the conductive member, the conductive member being exposed at a connection part for connection to the drive section, the imaging sensor being exposed at the light-receiving surface.
申请公布号 US2013038783(A1) 申请公布日期 2013.02.14
申请号 US201213565246 申请日期 2012.08.02
申请人 SONY CORPORATION;SHIMIZU MASAHIKO;IWAFUCHI TOSHIAKI 发明人 SHIMIZU MASAHIKO;IWAFUCHI TOSHIAKI
分类号 H04N5/225;H05K13/00 主分类号 H04N5/225
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