ELECTRONIC COMPONENT EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

Provided is a manufacturing method for an electronic component (400) embedded circuit board, including: embedding an electronic component (400) into a through-hole of a core layer on a circuit board, with one side of the electronic component (400) having an aluminium electrode (401); and zincing the aluminum electrode (401), and nickelling the surface of the zinced aluminium electrode (401). Also provided is a corresponding electronic component (400) embedded circuit board. Since a zinc and nickel protection layer (403) is formed on the surface of an aluminium electrode (401) by applying zincing processing and nickelling processing in the technical solution of the present invention, the aluminium electrode (401) will not be damaged by laser or any kind of acid or alkaline chemical solutions during the subsequent circuit board manufacturing flow.