发明名称 LIGHT EMITTING MOUDULE
摘要 PURPOSE: A light emitting module is provided to improve durability by electrically connecting a light emitting device package to a circuit board with a bonding method using a conductive member or direct bonding. CONSTITUTION: A circuit board has a hole. The entire or part of an insulation board(102) spatially overlaps with the hole. The insulation board includes at least one or more light emitting devices(104) and a circuit pattern(103). The circuit pattern is electrically connected to the light emitting device. A conductive connection member(110) electrically connects the circuit pattern to the circuit board.
申请公布号 KR20130015220(A) 申请公布日期 2013.02.13
申请号 KR20110077096 申请日期 2011.08.02
申请人 LG INNOTEK CO., LTD. 发明人 OH, NAM SEOK;CHO, YUN MIN;LEE, JONG WOO
分类号 F21S2/00;H01L33/00 主分类号 F21S2/00
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